The global hermetic packaging market size was valued at USD 3.95 billion in 2023 and is projected to grow from USD 4.21 billion in 2024 to USD 7.31 billion by 2032, exhibiting a CAGR of 7.14% during the forecast period.
The hermetic packaging market refers to the industry segment involved in the production and supply of hermetic packaging solutions. Hermetic packaging involves sealing electronic components or devices in airtight containers to protect them from environmental factors such as moisture, gases, humidity, and other contaminants. This type of packaging is essential for applications where maintaining the integrity and reliability of sensitive components is critical, such as aerospace, automotive, medical devices, telecommunications, and military sectors.
Key features of hermetic packaging include:
- Airtight Sealing: Hermetic packaging ensures a complete seal that prevents the ingress of external contaminants, including moisture and gases, which could compromise the performance and longevity of electronic components.
- Material Selection: Hermetic packages are typically made from materials such as metals (e.g., aluminum, titanium, Kovar) and ceramics, chosen for their impermeability and compatibility with the enclosed components.
- Reliability: Hermetic packaging provides robust protection, ensuring the long-term reliability and functionality of electronic devices, even in harsh operating environments.
- Customization: Hermetic packages can be customized to meet specific requirements, including size, shape, and sealing methods, to accommodate various electronic components and applications.
- Applications: Hermetic packaging finds applications in a wide range of industries, including aerospace and defense (for avionics, missile systems, satellites), automotive (engine control units, sensors), medical devices (implantable devices, pacemakers), telecommunications (optoelectronic components, RF/microwave devices), and industrial electronics.
Key Companies:
- TELEDYNE (U.S.)
- SCHOTT (Germany)
- Amkor Technology, Inc. (U.S.)
- KYOCERA Corporation (Japan)
- Materion Corporation (U.S.)
- Egide (France)
- SGA Technologies (U.K.)
The hermetic packaging market is driven by factors such as the increasing demand for reliable electronic components in critical applications, advancements in microelectronics and semiconductor technologies, stringent quality standards, and the growing adoption of hermetic packaging solutions in emerging sectors such as IoT (Internet of Things) and wearable devices.
Information Source:-https://www.fortunebusinessinsights.com/hermetic-packaging-market-109188
